Patent Assignment
Reel/Frame 023932/0601
Assignment of Assignor's Interest
Recorded: 2010-02-12
Pages: 3
Assignor
HORIKOSHI, TAKAHIRO
Executed: 2010-02-02
Assignee
NIKON CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8331, JAPAN
Covered Property
(1)
Substrate Bonding Apparatus and Substrate Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.