Patent Assignment
Reel/Frame 022028/0103
Assignment of Assignor's Interest
Recorded: 2008-12-24
Pages: 2
Assignor
MATSUI, ISAO
Executed: 2008-12-09
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Multi-Layered Wiring Substrate and Method of Manufacturing the Same