IP Library Assignment 022039/0483
Patent Assignment
Reel/Frame 022039/0483

Assignment of Assignor's Interest

Recorded: 2008-12-30 Pages: 6
Assignors
YANG, CHIH-CHAO
Executed: 2008-08-08
BASKER, VEERARAGHAVAN S
Executed: 2008-08-11
TONTI, WILLIAM
Executed: 2008-08-12
WONG, KEITH KWONG HON
Executed: 2008-08-08
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
A Method of Forming an Interconnect Structure Including a Metallic Interfacial Layer Located at a Bottom via Portion
Patent: 8,288,276 →
Application: 12/346,040 →
Publication: US 2010/0164111
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Assignment of Assignor's Interest Feb 24, 2017
From: GLOBALFOUNDRIES INC.
To: AURIGA INNOVATIONS, INC.
Reel/Frame 041804/0940 →