Patent Assignment
Reel/Frame 022044/0656
Assignment of Assignor's Interest
Recorded: 2008-12-31
Pages: 7
Assignors
SHIVE, LARRY WAYNE
Executed: 2008-10-06
GILMORE, BRIAN LAWRENCE
Executed: 2008-10-03
SNYDER, TIMOTHY JOHN
Executed: 2008-10-13
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Support for a Semiconductor Wafer in a High Temperature Environment
Application:
12/253,664 →
Publication:
US 2010/0098519
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →