Assignment of Assignor's Interest

Recorded: 2008-12-16 Pages: 3

Assignors

KIM, KYOUNGKOOK

Executed: 2008-12-03

PARK, YOUNGSOO

Executed: 2008-12-03

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Multi-Chip Package for Led Chip and Multi-Chip Package Led Device Including the Multi-Chip Package

Patent: 8,030,670 →

Application: 12/314,738 →

Publication: US 2009/0321776