Multi-chip package for LED chip and multi-chip package LED device including the multi-chip package
Provided is a multi-chip package light emitting diode (LED) device including a plurality of LED chips within a single package. The LED device may include a base substrate, a multi-chip package for a LED on the base substrate, and a light radiator surrounding the multi-chip package and radiating light emitted by the multi-chip package for a LED, wherein the multi-chip package for a LED may include a plurality of LED chips on a single wafer substrate.
1. A multi-chip package for a light emitting diode (LED) comprising:
a plurality of LED chips on a single wafer substrate, the plurality of LED chips being connected to each other in parallel,
wherein each of the plurality of LED chips includes,
a first clad layer on the single wafer substrate,
an active layer partially formed on a top surface of the first clad layer,
a second clad layer on the active layer,
a first electrode partially formed on a top surface of the first clad layer, and
a second electrode on the second clad layer,
a package block including the plurality of LED chips;
first and second bonding pads on the package block and connected to an external power source;
a first wiring pattern connecting the first bonding pad and the first electrode of each of the plurality of LED chips; and
a second wiring pattern connecting the second bonding pad and the second electrode of each of the plurality of LED chips.
2. The multi-chip package of claim 1 , wherein the plurality of LED chips share the single wafer substrate and the first clad layer.
3. The multi-chip package of claim 1 , wherein the first and second wiring patterns are on the wafer substrate.
4. The multi-chip package of claim 1 , further comprising:
at least two wiring groups each including the first and second bonding pads and the first and second wiring patterns.
5. The multi-chip package of claim 4 , wherein each of the two or more wiring groups is connected to different LED chips.
6. A light emitting diode (LED) device comprising:
a base substrate;
a multi-chip package for a LED on the base substrate; and
a light emitter surrounding the multi-chip package and emitting light generated in the multi-chip package for a LED,
wherein the multi-chip package for a LED includes,
a plurality of LED chips on a single wafer substrate, the plurality of LED chips being connected to each other in parallel,
a package block including the plurality of LED chips,
first and second bonding pads on the package block and connected to an external power source,
a first wiring pattern connecting the first bonding pad and the first electrode of each of the plurality of LED chips, and
a second wiring pattern connecting the second bonding pad and the second electrode of each of the plurality of LED chips, and
wherein each of the plurality of LED chips includes,
a first clad layer on the single wafer substrate,
an active layer partially formed on a top surface of the first clad layer,
a second clad layer on the active layer,
a first electrode partially formed on a top surface of the first clad layer, and
a second electrode on the second clad layer.
7. The LED device of claim 6 , wherein the plurality of LED chips share the single wafer substrate and the first clad layer.
8. The LED device of claim 6 , wherein the first and second wiring patterns are on the wafer substrate.
9. The LED device of claim 6 , wherein the plurality of LED chips are turned on or off simultaneously.
10. The LED device of claim 6 , wherein the multi-chip package comprises at least two wiring groups each including the first and second bonding pads and the first and second wiring patterns.
11. The LED device of claim 10 , wherein each of the two or more wiring groups is connected to different LED chips.
12. The LED device of claim 11 , wherein some of the plurality of LED chips are turned on or off independently.
13. The LED device of claim 6 , wherein current density of electric current supplied to each of the LED chips is between about 0.1 A/cm 2 and about 50 A/cm 2 .