IP Library Assignment 022116/0488
Patent Assignment
Reel/Frame 022116/0488

Assignment of Assignor's Interest

Recorded: 2009-01-15 Pages: 2
Assignors
DOELLE, MICHAEL B.
Executed: 2009-01-13
BERGMANN, JOACHIM
Executed: 2009-01-13
Assignee
SILICON MICROSTRUCTURES, INC.
1701 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Sensor Element Placement for Package Stress Compensation
Patent: 8,132,465 →
Application: 12/184,159 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jun 21, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060257/0267 →