Patent Assignment
Reel/Frame 060257/0267
Merger
Recorded: 2022-06-21
Pages: 11
Assignor
SILICON MICROSTRUCTURES, INC.
Executed: 2021-03-19
Assignee
MEASUREMENT SPECIALTIES, INC.
1000 LUCAS WAY, HAMPTON, VIRGINIA, 23666
Covered Properties
(18)
Extremely Low Cost Pressure Sensor Realized Using Deep Reactive Ion Etching
Patent:
7,111,518 →
Application:
10/665,991 →
Pressure Sensor Adjustment Using Backside Mask
Patent:
7,487,681 →
Application:
11/834,013 →
Sensor Element and Sensor Assembly Provided with a Casing
Sensor Element Placement for Package Stress Compensation
Patent:
8,132,465 →
Application:
12/184,159 →
Compensation of Stress Effects on Pressure Sensor Components
Pressure Sensing Device Having Contacts Opposite a Membrane
Compensation of Stress Effects on Pressure Sensor Components
Method for Measuring a Microelectromechanical Semiconductor Component
Vertical Membranes for Pressure Sensing Applications
Manufacturing Catheter Sensors
Manufacturing Catheter Sensors
Light Shields for Catheter Sensors
Pressure Sensor Cap Having Flow Path with Dimension Variation
3D Contact Force Sensing
Voltage Nulling Pressure Sensor Preamp
Low-Pressure Sensor with Stiffening Ribs
Leadless Pressure Sensor
Sensor Device and Methods of Operation for a Catheter Based Treatment of Myocardial Microvascular Obstruction
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 30, 2004
From: ALLEN, HENRY V.; TERRY, STEPHEN C.; KNUTTI, JAMES W.
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 014473/0509 →
Assignment of Assignor's Interest
Jun 2, 2008
From: REIJS, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021026/0909 →
Corrective Assignment to Correct the Assignee's Postal Code Previously Recorded on Reel 021026 Frame 0909. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jul 22, 2008
From: REIJA, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021274/0319 →
Assignment of Assignor's Interest
Jan 15, 2009
From: DOELLE, MICHAEL B.; BERGMANN, JOACHIM
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 022116/0488 →
Assignment of Assignor's Interest
Apr 28, 2011
From: AUGUST, RICHARD J.; DOELLE, MICHAEL B.
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 026193/0259 →
Assignment of Assignor's Interest
Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →
Settlement Agreement
Jun 22, 2012
From: SENCIO B.V.
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 028430/0026 →
Assignment of Assignor's Interest
Nov 14, 2012
From: GAYNOR, JUSTIN
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 029296/0643 →
Assignment of Assignor's Interest
Jun 5, 2013
From: BINKHOFF, PETER
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030548/0366 →
Assignment of Assignor's Interest
May 16, 2014
From: DOERING, HOLGER
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 032918/0418 →
Assignment of Assignor's Interest
Aug 10, 2016
From: DOERING, HOLGER; TERRY, STEPHEN C.; GAYNOR, JUSTIN; ABED, OMAR
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 039388/0990 →
Assignment of Assignor's Interest
Sep 13, 2017
From: DOERING, HOLGER; TERRY, STEPHEN C.; GAYNOR, JUSTIN; ABED, OMAR
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 043579/0413 →
Assignment of Assignor's Interest
Jan 17, 2018
From: DOERING, HOLGER; TERRY, STEPHEN C.; GAYNOR, JUSTIN; ABED, OMAR
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 044643/0143 →
Corrective Assignment to Correct the Inventor's Name from Fernardo Alfaro to Fernando Alfaro Previously Recorded on Reel 044643 Frame 0143. Assignor(S) Hereby Confirms the Assignment of Assignors Interest.
Jan 18, 2018
From: DOERING, HOLGER; TERRY, STEPHEN C.; GAYNOR, JUSTIN; ABED, OMAR
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 046266/0041 →
Assignment of Assignor's Interest
Jul 31, 2019
From: JAMALI, ARMIN
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 049922/0689 →
Assignment of Assignor's Interest
Oct 17, 2019
From: ALLEN, HENRY
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 050752/0848 →
Assignment of Assignor's Interest
Dec 31, 2019
From: ALFARO, FERNANDO
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051395/0340 →
Assignment of Assignor's Interest
Jan 19, 2020
From: WAGNER, CHRIS
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051551/0592 →
Assignment of Assignor's Interest
Feb 3, 2020
From: KELLER, CRAIG A.
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051705/0044 →
Assignment of Assignor's Interest
Feb 3, 2020
From: DOERING, HOLGER; ABED, OMAR
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051704/0935 →
Assignment of Assignor's Interest
Feb 14, 2020
From: GAYNOR, JUSTIN
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051823/0270 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Assignment of Assignor's Interest
May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →