Patent Assignment
Reel/Frame 028430/0026
Settlement Agreement
Recorded: 2012-06-22
Pages: 24
Assignor
SENCIO B.V.
Executed: 2012-01-27
Assignee
ELMOS SEMICONDUCTOR AG
HEINRICH-HERTZ-STR. 1, DORTMUND, 44227, GERMANY
Covered Property
(1)
Sensor Element and Sensor Assembly Provided with a Casing
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 2008
From: REIJS, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021026/0909 →
Corrective Assignment to Correct the Assignee's Postal Code Previously Recorded on Reel 021026 Frame 0909. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jul 22, 2008
From: REIJA, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021274/0319 →
Assignment of Assignor's Interest
Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →
Assignment of Assignor's Interest
May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Merger
Jun 21, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060257/0267 →