Patent Assignment
Reel/Frame 056296/0706
Assignment of Assignor's Interest
Recorded: 2021-05-20
Pages: 6
Assignor
ELMOS SEMICONDUCTOR SE
Executed: 2021-05-10
Assignee
SILICON MICROSTRUCTURES, INC.
1701 MCCARTHY BOULEVARD, MILPITAS, CALIFORNIA, 95035
Covered Properties
(15)
Sensor Element and Sensor Assembly Provided with a Casing
Pressure-Sensitive Amplifier Stage
Microelectromechanical Semiconductor Component That Is Sensitive to Mechanical Stresses, and Comprises an Ion Implantation Masking Material Defining a Channel Region
Method for the Production of Micro-Electromechanical Semiconductor Component
Micro-Electromechanical Semiconductor Comprising Stress Measuring Element and Stiffening Braces Separating Wall Depressions
Micro-Electromechanical Semiconductor Component
Micro-Electromechanical Semiconductor Component and Method for the Production Thereof
Method for Producing a Microelectromechanical Device and Microelectromechanical Device
Stress-Sensitive Micro-Electromechanical Device and Use Thereof
Microelectromechanical Component and Method for Testing a Microelectromechanical Component
Method for Measuring a Microelectromechanical Semiconductor Component
Method and Device for Measuring a Microelectromechanical Semiconductor Component
Semiconductor Component
Micro-Electromechanical Semiconductor Component
Method for Producing a Microelectromechanical Device and Microelectromechanical Device
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 2, 2008
From: REIJS, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021026/0909 →
Corrective Assignment to Correct the Assignee's Postal Code Previously Recorded on Reel 021026 Frame 0909. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jul 22, 2008
From: REIJA, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021274/0319 →
Assignment of Assignor's Interest
Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →
Assignment of Assignor's Interest
Feb 13, 2012
From: BUESSER, WOLFGANG
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 027691/0565 →
Settlement Agreement
Jun 22, 2012
From: SENCIO B.V.
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 028430/0026 →
Assignment of Assignor's Interest
Nov 21, 2012
From: BURCHARD, BERND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029337/0362 →
Assignment of Assignor's Interest
Nov 21, 2012
From: TEN-HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029337/0492 →
Assignment of Assignor's Interest
Dec 7, 2012
From: SENF, REINHARD
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029424/0872 →
Assignment of Assignor's Interest
Dec 20, 2012
From: TEN HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029512/0610 →
Assignment of Assignor's Interest
Dec 20, 2012
From: TEN HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029512/0500 →
Assignment of Assignor's Interest
Mar 14, 2013
From: DOELLE, MICHAEL
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030003/0019 →
Assignment of Assignor's Interest
Apr 11, 2013
From: BURCHARD, BERND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030200/0132 →
Assignment of Assignor's Interest
Apr 11, 2013
From: DOELLE, MICHAEL; NINGNING, ZHOU
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 030200/0274 →
Assignment of Assignor's Interest
Jun 5, 2013
From: BINKHOFF, PETER
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030548/0366 →
Assignment of Assignor's Interest
Jun 5, 2013
From: BINKHOFF, PETER
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030546/0936 →
Assignment of Assignor's Interest
Aug 14, 2013
From: BURCHARD, BERND; DOELLE, MICHAEL
To: ELMOS SEMICONDUCTOR AG; SILICON MICROSTRUCTURES, INC.
Reel/Frame 031004/0786 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Merger
Jun 17, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060237/0556 →
Merger
Jun 21, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060257/0267 →