IP Library Granted Patent US 9,399,572
Granted Patent B2
US 9,399,572 · App. 13/981,506 · Granted Jul 26, 2016

Microelectromechanical component and method for testing a microelectromechanical component

Inventors: Bernd Burchard (Essen, DE); Michael Doelle (Munich, DE)
Assignee: Elmos Semiconductor AG
B81B3/0018B81C99/0045G01L25/00G01L27/007B81B2201/0264
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Quick Facts
Patent No.
US 9,399,572
App. No.
13/981,506
Granted
Jul 26, 2016
Kind
B2
Abstract

The microelectromechanical component has a semiconductor substrate ( 1 ), which has a cavity ( 2 a ) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane ( 2 ). A sensor ( 17 ) for detecting a deformation of the membrane ( 2 ) is formed within the region of the membrane ( 2 ). A test actuator ( 28, 29, 30 ) for deforming the membrane ( 2 ) for testing purposes is also arranged within the region of the membrane ( 2 ). Finally, the microelectromechanical component has an evaluation and activation unit ( 41 ) connected to the sensor ( 17 ) and the test actuator ( 28, 29, 30 ) for activating the test actuator ( 28, 29, 30 ) in order to deform the membrane ( 2 ) as a test and for evaluating a measurement signal of the sensor ( 17 ) as a sensor detection of a deformation of the membrane ( 2 ) as a result of the activation of the test actuator ( 28, 29, 30 ).

Claims (51)

1. A microelectromechanical component comprising

a semiconductor substrate,

a cavity formed in the semiconductor substrate, which cavity is covered by a reversibly deformable membrane,

wherein the membrane has portions in which material tensions of different strength occur during the deformation of the membrane,

a sensor for detecting a deformation of the membrane, and

a test actuator for deforming the membrane for test purposes,

wherein the membrane, on an edge that comprises at least two opposite edge portions, is connected to the semiconductor substrate,

wherein the material tensions generated in the membrane across the whole extension of the membrane during deformation of the membrane are greater along the edge of the membrane than at other portions of the membrane,

wherein the test actuator is arranged at a site of a first edge portion of the membrane in which the material tension is maximal during deformation of the membrane, wherein the sensor is arranged at a site of a second edge portion of the membrane, and

whereby a distance between the test actuator and the sensor along the edge of the membrane is maximized.

2. The microelectromechanical component of claim 1 , wherein the sensor is arranged opposite the acuator.

3. The microelectromechanical component of claim 1 , wherein the test actuator is an electrothermal transducer for the local heating of the membrane.

4. The microelectromechanical component of claim 3 , wherein the electrothermal transducer is a heating element including a resistance heating element for heating a material layer formed on the membrane the material layer including one of a metal layer and a layer also including metal of the heating element, wherein the material layer and the semiconductor substrate have different thermal expansion coefficients.

5. The microelectromechanical component of claim 1 , wherein the test actuator includes at least one of an electrostatic-mechanical a magnetostatic-mechanical and an electrodynamic transducer.

6. The microelectromechanical component of claim 1 , wherein the sensor includes a piezo-resistive transistor.

7. The microelectromechanical component of claim 1 , including an evaluation and activation unit, connected with the sensor and the test actuator, for activating the test actuator to deform the membrane as a test and for evaluating a measuring signal of the sensor as a sensor detection of a deformation of the membrane as a result of the activation of the test actuator.

8. A method for testing the functionality of a microelectromechanical component that is provided with

a semiconductor substrate,

a cavity formed in the semiconductor substrate, which cavity is covered by a reversibly deformable membrane,

wherein the membrane has portions in which material tensions of different strength occur during the deformation of the membrane,

a sensor for detecting a deformation of the membrane, and

a test actuator for deforming the membrane for test purposes,

wherein the membrane, on an edge that comprises at least two opposite edge portions, is connected to the semiconductor substrate,

wherein the material tensions generated in the membrane across the whole extension of the membrane during deformation of the membrane are greater along the edge of the membrane than at other portions of the membrane,

wherein the test actuator is arranged at a site of a first edge portion of the membrane in which the material tension is maximal during deformation of the membrane,

wherein the sensor is arranged at a site of a second edge portion of the membrane in which the material tension is maximal during deformation of the membrane, and

whereby a distance between the test actuator and the sensor along the edge of the membrane is maximized,

wherein in the method

the test actuator is activated to deform the membrane as a test and, thereafter, an evaluation unit included in the microelectromechanical component determines from a measuring signal of the sensor, whether a deformation of the membrane has been detected.

9. The method of claim 8 , wherein a degree of a deformation of the membrane is determined from the measuring signal of the sensor and that the degree of deformation is compared to a predeterminable target deformation.

10. The microelectromechanical component of claim 3 , wherein the sensor includes a piezo-resistive transistor.

11. The microelectromechanical component of claim 4 , wherein the sensor includes a piezo-resistive transistor.

12. The microelectromechanical component of claim 5 , wherein the sensor includes a piezo-resistive transistor.

13. The microelectromechanical component of claim 3 , including an evaluation and activation unit, connected with the sensor and the test actuator, for activating the test actuator to deform the membrane as a test and for evaluating a measuring signal of the sensor as a sensor detection of a deformation of the membrane as a result of the activation of the test actuator.

14. The microelectromechanical component of claim 4 , including an evaluation and activation unit, connected with the sensor and the test actuator, for activating the test actuator to deform the membrane as a test and for evaluating a measuring signal of the sensor as a sensor detection of a deformation of the membrane as a result of the activation of the test actuator.

15. The microelectromechanical component of claim 5 , including an evaluation and activation unit, connected with a sensor and the test actuator, for activating the test actuator to deform the membrane as a test and for evaluating a measuring signal of the sensor as a sensor detection of a deformation of the membrane as a result of the activation of the test actuator.

16. The microelectromechanical component of claim 6 , including an evaluation and activation unit, connected with the sensor and the test actuator, for activating the test actuator to deform the membrane as a test and for evaluating a measuring signal of the sensor as a sensor detection of a deformation of the membrane as a result of the activation of the test actuator.

17. The microelectromechanical component of claim 6 wherein the piezo-resistive transistor includes at least one of a MOS or a FET transistor.

18. A microelectromechanical component comprising:

a semiconductor substrate,

a cavity formed in the semiconductor substrate, which cavity is covered by a reversibly deformable membrane, the cavity defined by an outer edge having one or more first portions and one or more second portions, wherein the membrane includes portions in which material tension strengths differ from material tension strengths in other portions during the deformation of the membrane,

wherein the material tensions generated in the membrane during deformation of the membrane are greater along the edge of the membrane than at other portions of the membrane,

wherein one or more test actuators are arranged respectively at one or more first edge portions in which the material tension is maximal during deformation of the membrane,

wherein one or more sensors are arranged respectively at one or more second edge portions of the membrane in which the material tension is maximal during deformation of the membrane, and

further wherein the one or more first edge portions and one or more second edge portions are arranged alternately and evenly-spaced along the outer edge such that a distance between each sensor and each adjacent actuator is maximized.

19. The microelectromechanical component of claim 18 wherein:

the membrane is substantially circular.

20. The micromechanical component of claim 18 wherein:

the membrane is substantially in the form of a rectangle having a first side and a second side opposite the first side,

the first edge portion is arranged in a central portion of the first side, and

the second edge portion is arranged in a central portion of the second side.

Assignments (4)
MERGER Recorded Jun 17, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060237/0556 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
CHANGE OF NAME Recorded May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 14, 2013
From: BURCHARD, BERND; DOELLE, MICHAEL
To: ELMOS SEMICONDUCTOR AG; SILICON MICROSTRUCTURES, INC.
Reel/Frame 031004/0786 →
Priority Claims (1)
EP 11152566 · Jan 28, 2011 · regional
Continuity (1)
Related Publication 20130305804A1 · Nov 21, 2013