Patent Assignment
Reel/Frame 060237/0556
Merger
Recorded: 2022-06-17
Pages: 11
Assignor
SILICON MICROSTRUCTURES, INC.
Executed: 2021-03-19
Assignee
MEASUREMENT SPECIALTIES, INC.
1000 LUCAS WAY, HAMPTON, VIRGINIA, 23666
Covered Properties
(15)
Cmos Compatible Pressure Sensor for Low Pressures
Pressure-Sensitive Amplifier Stage
Microelectromechanical Semiconductor Component That Is Sensitive to Mechanical Stresses, and Comprises an Ion Implantation Masking Material Defining a Channel Region
Method for the Production of Micro-Electromechanical Semiconductor Component
Micro-Electromechanical Semiconductor Comprising Stress Measuring Element and Stiffening Braces Separating Wall Depressions
Micro-Electromechanical Semiconductor Component
Micro-Electromechanical Semiconductor Component and Method for the Production Thereof
Method for Producing a Microelectromechanical Device and Microelectromechanical Device
Stress-Sensitive Micro-Electromechanical Device and Use Thereof
Microelectromechanical Component and Method for Testing a Microelectromechanical Component
Method and Device for Measuring a Microelectromechanical Semiconductor Component
Semiconductor Component
Micro-Electromechanical Semiconductor Component
Method for Producing a Microelectromechanical Device and Microelectromechanical Device
Pressure Sensor Die Attach
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 21, 2011
From: DOERING, HOLGER; CHOLEWA, RAINER
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 025679/0872 →
Assignment of Assignor's Interest
Feb 13, 2012
From: BUESSER, WOLFGANG
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 027691/0565 →
Assignment of Assignor's Interest
Nov 21, 2012
From: TEN-HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029337/0492 →
Assignment of Assignor's Interest
Nov 21, 2012
From: BURCHARD, BERND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029337/0362 →
Assignment of Assignor's Interest
Dec 7, 2012
From: SENF, REINHARD
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029424/0872 →
Assignment of Assignor's Interest
Dec 20, 2012
From: TEN HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029512/0500 →
Assignment of Assignor's Interest
Dec 20, 2012
From: TEN HAVE, ARND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 029512/0610 →
Assignment of Assignor's Interest
Mar 14, 2013
From: DOELLE, MICHAEL
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030003/0019 →
Assignment of Assignor's Interest
Apr 11, 2013
From: DOELLE, MICHAEL; NINGNING, ZHOU
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 030200/0274 →
Assignment of Assignor's Interest
Apr 11, 2013
From: BURCHARD, BERND
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030200/0132 →
Assignment of Assignor's Interest
Jun 5, 2013
From: BINKHOFF, PETER
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 030546/0936 →
Assignment of Assignor's Interest
Aug 14, 2013
From: BURCHARD, BERND; DOELLE, MICHAEL
To: ELMOS SEMICONDUCTOR AG; SILICON MICROSTRUCTURES, INC.
Reel/Frame 031004/0786 →
Assignment of Assignor's Interest
Dec 30, 2019
From: RAZAVIDINANI, KEYANOUSH; SPRAKELAAR, GERTJAN VAN; WAGNER, CHRIS
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 051390/0100 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Assignment of Assignor's Interest
May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →