Semiconductor component

1. A micro-electromechanical device comprising:

a bendable micro-electromechanical semiconductor component being reversibly bendable; and

an electronic semiconductor component which is integrated into the bendable micro-electromechanical semiconductor and which is sensitive to mechanical stresses of the bendable micro-electrical semiconductor component, the electronic semiconductor component comprising:

a semiconductor substrate, in an upper face of which an active region made of a material of a first conductivity type is introduced by ion implantation; and

a semiconducting channel region having a defined length and width being formed within the active region;

wherein, in the active region, each end of the channel region is arranged in a longitudinal extension being followed by a contacting region made of a semiconductor material of a second conductivity type,

wherein the channel region is covered by an ion implantation masking material, which comprises transverse edges defining the length of the channel region and longitudinal edges defining the width of the channel region and which comprises an edge recess at each of the opposing transverse edges aligned with the longitudinal extension ends of the channel region,

wherein ion implantation regions are inserted along the longitudinal edges of the ion implantation masking material, the ion implantation regions laterally delimiting the channel region, and wherein the boundaries of the ion implantation regions toward the channel region are in alignment with the longitudinal edges of the ion implantation masking material, and

wherein the contacting regions that adjoin the channel region extend all the way into the edge recess.

2. The micro-electromechanical device of claim 1 , wherein the edge recesses of the electronic semiconductor component are substantially U-shaped and comprise two opposite, mutually parallel lateral edges having respectively one base edge connecting them, the lateral edges of both edge recesses being arranged in pairs respectively on a common line.

3. The micro-electromechanical device of claim 1 , wherein each of the longitudinal edges of the ion implantation masking material comprises substantially U-shaped edge recesses having respectively one base edge arranged in the channel longitudinal extension and has lateral edges which extend substantially at right angles therefrom, and that the base edges of the longitudinal edge recesses of the ion implantation masking material are each arranged on the common line of the lateral edges of the transverse edge recesses of the ion implantation masking material.

4. The micro-electromechanical device of claim 1 , wherein a channel implant is inserted into the active region of the electronic semiconductor component below the ion implantation masking material.

5. The micro-electromechanical device of claim 1 , wherein the first conductive type of the electronic semiconductor component is an n-type semiconductor and the second conductive type of the electronic semiconductor component is a p-type semiconductor.

6. The micro-electromechanical device of claim 1 , further comprising:

at least four electronic semi-conductor components comprising at least one measurement bridge.

7. The micro-electromechanical device of claim 1 , further comprising a pressure sensor.

8. The micro-electromechanical device of claim 1 , further comprising a plurality of electronic semi-conductor components.

9. The micro-electromechanical device of claim 6 , wherein the plurality of electronic semi-conductor components comprises a circuit that generates a signal associated with a different state of at least one physical parameter of the plurality of electronic semi-conductor components.

10. The micro-electromechanical device of claim 8 , wherein the semi-conductor substrate includes a plurality of trenches, wherein each electronic semi-conductor component is arranged between two of the plurality of trenches.