CMOS compatible pressure sensor for low pressures
Pressure sensors having a topside boss and a cavity formed using deep reactive-ion etching (DRIE) or plasma etching. Since the boss is formed on the topside, the boss is aligned to other features on the topside of the pressure sensor, such as a Wheatstone bridge or other circuit elements. Also, since the boss is formed as part of the diaphragm, the boss has a reduced mass and is less susceptible to the effects of gravity and acceleration. These pressure sensors may also have a cavity formed using a DRIE or plasma etch. Use of these etches result in a cavity having edges that are substantially orthogonal to the diaphragm, such that pressure sensor die area is reduced. The use of these etches also permits the use of p-doped wafers, which are compatible with conventional CMOS technologies.
1. A pressure sensor comprising:
a first silicon layer comprising:
a top portion of a frame;
a boss; and
a plurality of beams defined by a plurality of trenches, each of the plurality of trenches having a depth less than a thickness of the first silicon layer, the plurality of beams connecting the boss to the top portion of the frame; and
a second silicon layer comprising a bottom portion of the frame, wherein the bottom portion of the frame is defined by an opening defined by a sidewall, the sidewall substantially orthogonal to the boss.
2. The pressure sensor of claim 1 further comprising:
a first silicon dioxide layer between the first silicon layer and the second layer.
3. The pressure sensor of claim 2 wherein the first silicon dioxide layer is formed at least in part by oxidizing a bottom surface of the first silicon layer.
4. The pressure sensor of claim 2 wherein the first silicon dioxide layer is formed at least in part by oxidizing a top surface of the second silicon layer.
5. The pressure sensor of claim 2 further comprising at least one component located on at least one of the plurality of beams.
6. The pressure sensor of claim 2 further comprising a Wheatstone bridge located on one of the plurality of beams.
7. The pressure sensor of claim 6 wherein the Wheatstone bridge is comprised of resistors.
8. The pressure sensor of claim 6 wherein the Wheatstone bridge is comprised of field-effect transistors.
9. The pressure sensor of claim 2 further comprising a third silicon layer between the first silicon dioxide layer and the second silicon layer.
10. The pressure sensor of claim 9 further comprising a second silicon dioxide layer between the third silicon layer and the second silicon layer.
11. The pressure sensor of claim 1 wherein the first silicon layer comprises a p-doped silicon layer.
12. The pressure sensor of claim 1 wherein the sidewall is formed using deep-reactive ion etching.
13. The pressure sensor of claim 1 wherein a top side of the second silicon layer is adjacent to a bottom side of the first silicon layer.
14. The pressure sensor of claim 13 wherein the plurality of trenches are formed in a top side of the first silicon layer.
15. A pressure sensor comprising:
a boss defined by a plurality of trench walls, the trench walls formed in a top side of the pressure sensor;
a frame; and
a plurality of beams defined by the plurality of trench walls and connecting the frame to the boss,
wherein the frame comprises a backside cavity defined by a sidewall, the cavity extending from a backside opening to an underside of the boss, the backside opening forming an opening in a bottom side of the pressure sensor, the underside of the boss defined by an insulating layer, the sidewall substantially orthogonal to the underside of the boss.
16. The pressure sensor of claim 15 wherein the insulating layer is comprised of silicon dioxide.
17. The pressure sensor of claim 15 wherein the insulating layer is formed using a high-energy implantation.
18. The pressure sensor of claim 15 wherein the sidewall is formed using a first deep-reactive ion etch step and the plurality of trench walls are formed using a second deep-reactive ion etch step.
19. The pressure sensor of claim 15 further comprising at least one component located on at least one of the plurality of beams.
20. The pressure sensor of claim 15 wherein a depth of the trench walls is less than a thickness of the boss.
21. A pressure sensor comprising:
a diaphragm defined by a cavity formed in a backside of the pressure sensor, the cavity defined by a sidewall that extends from an opening in a bottom side of the pressure sensor to an underside of the diaphragm and is substantially orthogonal to the diaphragm; and
a frame surrounding the diaphragm,
wherein the diaphragm further comprises a boss defined by one or more trenches formed in the diaphragm, and one or more beams connecting the boss to the frame and defined by spaces between the one or more trenches, the trenches formed in a top side of the pressure sensor.
22. The pressure sensor of claim 21 wherein the pressure sensor is formed of p-doped silicon.
23. The pressure sensor of claim 21 further comprising at least one electrical component located on at least one of the plurality of beams.
24. The pressure sensor of claim 21 wherein a depth of the trench is less than a thickness of the boss.