Pressure sensor die attach
Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.
1. A pressure sensor system comprising:
a pressure sensor die having a membrane supported by a frame;
a package having a top surface and a trench located in the top surface, wherein a portion of the frame is located in the trench; and
a first material located in the trench, wherein the first material is located between a bottom of the frame and a bottom surface of the trench, and wherein the first material surrounds a bottom portion of the frame.
2. The pressure sensor system of claim 1 further comprising a passage through the package and forming an opening under the membrane.
3. The pressure sensor system of claim 2 wherein the first material is an adhesive.
4. The pressure sensor system of claim 2 wherein the first material is silicone.
5. A pressure sensor system comprising:
a pressure sensor die having a membrane supported by a frame;
a package having a top surface and a trench located in the top surface, wherein a portion of the frame is located in the trench;
a first material located in the trench, wherein the first material is located between a bottom of the frame and a bottom surface of the trench; and
a second material located in the trench and on the first material, wherein the second material surrounds a bottom portion of the frame.
6. The pressure sensor system of claim 5 further comprising a passage through the package and forming an opening under the membrane.
7. The pressure sensor system of claim 6 wherein the first material and the second material are adhesives.
8. The pressure sensor system of claim 7 wherein the first material and the second material comprise the same material.
9. The pressure sensor system of claim 6 wherein the second material is silicone.
10. A pressure sensor system comprising:
a tube having a center passage;
a substrate formed around the tube, the substrate having a trench in a top side, such that a top portion of the tube is exposed in the trench and the center passage of the tube forms at least a portion of a passage through the substrate;
a pressure sensor die having a membrane supported by a frame, wherein the membrane and the frame define a backside cavity in the pressure sensor die, and wherein a portion of the frame is located in the trench such that the top portion of the tube is located in the backside cavity of the pressure sensor die;
a first material located in the trench, wherein the first material is located between a bottom of the frame and a bottom surface of the trench; and
a second material located in the trench and on the first material, wherein the second material surrounds a bottom portion of the frame.
11. The pressure sensor system of claim 10 wherein the substrate is formed by injection molding.
12. The pressure sensor system of claim 11 wherein the first material and the second material are one or more adhesives.
13. The pressure sensor system of claim 11 wherein the first material is silicone.
14. The pressure sensor system of claim 11 wherein the second material is silicone.
15. The pressure sensor system of claim 1 wherein the membrane and the frame define a backside cavity in the pressure sensor die.
16. The pressure sensor system of claim 15 further comprising a passage through the package and forming an opening under the membrane in the backside cavity.