Patent Assignment
Reel/Frame 030200/0132
Assignment of Assignor's Interest
Recorded: 2013-04-11
Pages: 2
Assignor
BURCHARD, BERND
Executed: 2013-01-23
Assignee
ELMOS SEMICONDUCTOR AG
HEINRICH-HERTZ-STRASSE 1, DORTMUND, 44227, GERMANY
Covered Property
(1)
Stress-Sensitive Micro-Electromechanical Device and Use Thereof
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2013
From: DOELLE, MICHAEL; NINGNING, ZHOU
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 030200/0274 →
Assignment of Assignor's Interest
May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Merger
Jun 17, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060237/0556 →