IP Library › Assignment 031004/0786
Patent Assignment
Reel/Frame 031004/0786

Assignment of Assignor's Interest

Recorded: 2013-08-14 Pages: 4
Assignors
BURCHARD, BERND
Executed: 2013-07-10
DOELLE, MICHAEL
Executed: 2013-07-22
Assignees
ELMOS SEMICONDUCTOR AG
HEINRICH-HERTZ STRASSE 1, DORTMUND, 44227, GERMANY
SILICON MICROSTRUCTURES, INC.
1701 MCCARTHY BLVD, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Microelectromechanical Component and Method for Testing a Microelectromechanical Component
Patent: 9,399,572 →
Application: 13/981,506 →
Publication: US 2013/0305804
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
Change of Name May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Merger Jun 17, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060237/0556 →