IP Library › Assignment 026480/0333
Patent Assignment
Reel/Frame 026480/0333

Assignment of Assignor's Interest

Recorded: 2011-06-20 Pages: 4
Assignor
ELMOS ADVANCED PACKAGING B.V.
Executed: 2011-05-31
Assignee
SENCIO B.V.
MICROWEG-11, 6545 CL NIJMEGEN, NETHERLANDS
Covered Properties (6)
Method for Encapsulating an Integrated Circuit Having a Window
Patent: 5,863,810 →
Application: 08/434,909 →
Method for Encapsulating an Integrated Semi-Conductor Circuit
Patent: 5,897,338 →
Application: 08/871,960 →
Method for Encapsulating a Chip Having a Sensitive Surface
Patent: 7,312,106 →
Application: 10/472,907 →
Publication: US 2004/0171195
Method for Encapsulating a Chip and/or Other Article
Patent: 7,205,175 →
Application: 10/490,945 →
Publication: US 2005/0054144
Sensor Element and Sensor Assembly Provided with a Casing
Patent: 7,685,881 →
Application: 12/056,585 →
Publication: US 2008/0236292
Integrated Circuit Package
Patent: 8,049,290 →
Application: 12/369,959 →
Publication: US 2009/0206467
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 1995
From: KALDENBERG, PETER JACOBUS
To: EURATEC B.V.
Reel/Frame 007538/0224 →
Assignment of Assignor's Interest Nov 28, 1997
From: KALDENBERG, PETER JACOBUS
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 008824/0904 →
Assignment of Assignor's Interest Nov 3, 1999
From: EURATEC B.V.
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 010360/0625 →
Assignment of Assignor's Interest Apr 2, 2004
From: RABEN, JURGEN
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 014489/0570 →
Assignment of Assignor's Interest Oct 12, 2004
From: RABEN, JURGEN LEONARDUS THEODORUS MARIA
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 015241/0578 →
Assignment of Assignor's Interest Sep 27, 2005
From: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 016843/0503 →
Assignment of Assignor's Interest Apr 18, 2006
From: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM)
To: ELMOS ADVANCED PACKAGING BV
Reel/Frame 017492/0433 →
Assignment of Assignor's Interest Jun 2, 2008
From: REIJS, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021026/0909 →
Corrective Assignment to Correct the Assignee's Postal Code Previously Recorded on Reel 021026 Frame 0909. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Jul 22, 2008
From: REIJA, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021274/0319 →
Assignment of Assignor's Interest Feb 12, 2009
From: RABEN, JURGEN LEONARDUS THEODORUS MARIA
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 022250/0415 →
Settlement Agreement Jun 22, 2012
From: SENCIO B.V.
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 028430/0026 →
Change of Name May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Assignment of Assignor's Interest May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
Merger Jun 21, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060257/0267 →
Assignment of Assignor's Interest Jul 25, 2024
From: SENCIO B.V.
To: NEWAYS ADVANCED MICROSYSTEMS B.V.
Reel/Frame 068078/0055 →