Patent Assignment
Reel/Frame 068078/0055
Assignment of Assignor's Interest
Recorded: 2024-07-25
Pages: 5
Assignor
SENCIO B.V.
Executed: 2024-01-23
Assignee
NEWAYS ADVANCED MICROSYSTEMS B.V.
SCIENCE PARK EINDHOVEN 5010, SON EN BREUGEL, 5692 EA, NETHERLANDS
Covered Properties
(6)
Integrated Circuit Package
Integrated Circuit Package
Integrated Circuit Package
Integrated circuit package and method of manufacturing the same
Integrated Circuit Sensor Package and Method of Manufacturing the Same
Magnetic Sensor Assembly
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 2008
From: RABEN, JURGEN LEONARDUS THEODORUS MARIA
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021708/0701 →
Assignment of Assignor's Interest
Feb 12, 2009
From: RABEN, JURGEN LEONARDUS THEODORUS MARIA
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 022250/0415 →
Assignment of Assignor's Interest
Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →
Assignment of Assignor's Interest
Aug 11, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026731/0731 →
Assignment of Assignor's Interest
Jul 24, 2017
From: RABEN, JURGEN
To: SENCIO B.V.
Reel/Frame 043082/0282 →
Assignment of Assignor's Interest
Dec 12, 2018
From: VAN DOMMELEN, IGNATIUS JOSEPHUS; JANSEN, JOHANNES STEPHANUS
To: SENCIO B.V.
Reel/Frame 047750/0751 →
Assignment of Assignor's Interest
May 28, 2019
From: VAN DOMMELEN, IGNATIUS JOSEPHUS
To: SENCIO B.V.
Reel/Frame 049289/0095 →
Assignment of Assignor's Interest
Jan 18, 2023
From: VAN DOMMELEN, IGNATIUS JOSEPHUS
To: SENCIO B.V.
Reel/Frame 062403/0995 →