Integrated circuit package and method of manufacturing the same
Method of making an integrated circuit package, by a) providing a plurality of die members ( 4 a, 4 b ) connected to respective electrical contact members ( 8 a, 8 b ) in a mould; b) providing a mould insert in contact with at least a part of a first upper surface ( 6 a ) of a first die member ( 4 a ); c) encasing the plurality of die members ( 4 a, 4 b ) and the respective electrical contact members ( 8 a, 8 b ) into a package collection body ( 3 ); and d) cutting the package collection body ( 3 ) into at least two separate integrated circuit packages ( 3 a, 3 b ) along a first cutting line (S 1 ) extending through the package collection body ( 3 ) and separating the plurality of die members ( 4 a, 4 b ). The mould insert as provided in step b) extends across a part of the first cutting line (S 1 ).
1. A method of making an integrated circuit package, comprising the steps of
a) providing a plurality of die members connected to respective electrical contact members in a mould;
b) providing a mould insert in contact with at least a part of a first upper surface of a first die member;
c) encasing the plurality of die members and the respective electrical contact members into a package collection body; and
d) cutting the package collection body into at least two separate integrated circuit packages along a first cutting line extending through the package collection body and separating the plurality of die members, wherein the mould insert as provided in step b) extends across a part of the first cutting line, thereby forming a side opening in a side surface of each of the at lease two separate integrated circuit packages.
2. The method according to claim 1 , further comprising providing a second die member mirrored with respect to the first die member along the first cutting line.
3. The method according to claim 1 , wherein the at least two separate integrated circuit packages Quad Flat No-Lead (QFN) packages, Land Grid Array (LGA) or Ball Grid Array (BGA) packages.
4. The method according to claim 1 , further comprising arranging the plurality of die members and respective electrical contact members in an array.
5. The method according to claim 1 , wherein the first die member comprises an active element, such as a combustion starting element or a sensor element.
6. The method according to claim 1 , wherein the respective electrical contact members are not mirrored with respect to the first cutting line.
7. The method according to claim 1 , wherein the respective electrical contact members are mirrored with respect to the first cutting line.
8. The method according to claim 1 , further comprising arranging the mould insert symmetrically over the first cutting line.
9. The method according to claim 1 , further comprising selecting a circular, elliptical, square, rectangular or polygonal shape for the mould insert.
10. An integrated circuit package, comprising a die member connected to one or more electrical contact members encased in a package, and wherein a die opening is provided exposing at least a part of the die member, wherein one side surface of the package is a straight surface,
wherein the die opening comprises an upper opening extending from an upper surface of the package to an upper surface of the die member, and a side opening within the straight surface and extending from the straight surface to the upper surface of the die member wherein the side opening is formed as a cross section of the upper opening.
11. The integrated circuit package according to claim 10 , wherein the upper opening has a border wall extending from the upper major surface to the upper surface of the die member.
12. The integrated circuit package according to claim 10 , wherein the die member comprises a combustion starting element.