Method for encapsulating a chip having a sensitive surface
Method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, includes bonding a chip's contact pads to lead frame contact pads, positioning the chip and lead frame into one part of a two part mould, taking measures to keep the space above the sensitive surface of the chip free during the encapsulation process, closing the mould with a second mould part, introducing the package material into the closed mould and providing the circumstances to let the package cure. The method also including applying a closed dam of heat resistant material around the sensitive chip area and placing a lid on the dam such that space above the sensitive area enclosed by the dam and the lid is sealed.
1. A method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, comprising the sequential steps of:
A) mounting a chip having a sensitive chip surface and contact pads on a carrier having carrier contact pads;
B) bonding the chip contact pads to the carrier contact pads;
C) applying a closed dam around the sensitive chip surface, the applying of the closed dam defining an open space inside the dam;
D) positioning a lid closing the open space inside the dam;
E) positioning the chip and the carrier into a first part of a two part mould;
F) closing the mould by placing a second part of the two part mould on a top of the first part; and
G) introducing package material into the closed mould and providing circumstances to let the package cure in a desired manner to produce a formed package.
2. Method according to claim 1 , comprising the further step of keeping an upper surface of the lid free from an upper surface of the mould so that in the formed package, the top surface of said lid is positioned underneath an uppermost level of an upper surface of the formed package.
3. Method according to claim 2 , characterized in that, the mould has an inward projecting section which during the encapsulation process is in contact with the upper surface of the lid.
4. Method according to claim 3 , characterized in that a layer or element of resilient material is applied in between the lid and the inwards projecting section.
5. Method according to claim 2 , comprising the further step of applying a resilient material between a surface of the upper mould section and the upper surface of the lid.
6. Method according to claim 1 , characterized in that the carrier is embodied as a lead frame, a substrate, tape or other material comprising a conductive interconnection pattern.
7. Method according to claim 6 , comprising the further step of bonding chip contact pads to contact pads of said conductive interconnection pattern.
8. Method according to claim 1 , wherein, dimensions of the dam are selected such that bonding wires will be encapsulated either by the package material or by the dam.
9. Method according to claim 1 , characterized in that the lid has an opening providing direct access to an inner cavity surrounded by the chip, the dam, and an inner lid surface.
10. A method for encapsulating a chip having a sensitive surface exposed in a sealed highly clean cavity package, comprising the sequential steps of:
A) bonding chip contact pads, of a chip having a sensitive chip surface, to carrier contact pads of a carrier;
B) applying a closed dam around the sensitive chip surface to define an open space inside the dam;
C) positioning a lid to close the open space inside the dam;
D) positioning the chip and the carrier into a first part of a two part. mould;
E) closing the mould by placing a second part of the two part mould on a top of the first part; and
F) introducing package material into the closed mould to form a sealed highly clean cavity package.