IP Library Assignment 014489/0570
Patent Assignment
Reel/Frame 014489/0570

Assignment of Assignor's Interest

Recorded: 2004-04-02 Pages: 2
Assignor
RABEN, JURGEN
Executed: 2004-03-26
Assignee
EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
P.O. BOX 566, NL-6500 AN NIJMEGEN THE, NETHERLANDS
Covered Property (1)
Method for Encapsulating a Chip Having a Sensitive Surface
Patent: 7,312,106 →
Application: 10/472,907 →
Publication: US 2004/0171195
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 18, 2006
From: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM)
To: ELMOS ADVANCED PACKAGING BV
Reel/Frame 017492/0433 →
Assignment of Assignor's Interest Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →