IP Library › Assignment 017492/0433
Patent Assignment
Reel/Frame 017492/0433

Assignment of Assignor's Interest

Recorded: 2006-04-18 Pages: 3
Assignor
Assignee
ELMOS ADVANCED PACKAGING BV
MICROWEG 1-11, NIJMEGEN, 6545 CL, NETHERLANDS
Covered Properties (3)
Method for Encapsulating an Integrated Circuit Having a Window
Patent: 5,863,810 →
Application: 08/434,909 →
Method for Encapsulating an Integrated Semi-Conductor Circuit
Patent: 5,897,338 →
Application: 08/871,960 →
Method for Encapsulating a Chip Having a Sensitive Surface
Patent: 7,312,106 →
Application: 10/472,907 →
Publication: US 2004/0171195
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 1995
From: KALDENBERG, PETER JACOBUS
To: EURATEC B.V.
Reel/Frame 007538/0224 →
Assignment of Assignor's Interest Nov 28, 1997
From: KALDENBERG, PETER JACOBUS
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 008824/0904 →
Assignment of Assignor's Interest Nov 3, 1999
From: EURATEC B.V.
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 010360/0625 →
Assignment of Assignor's Interest Apr 2, 2004
From: RABEN, JURGEN
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 014489/0570 →
Assignment of Assignor's Interest Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →