IP Library › Assignment 016843/0503
Patent Assignment
Reel/Frame 016843/0503

Assignment of Assignor's Interest

Recorded: 2005-09-27 Pages: 2
Assignor
Assignee
ELMOS ADVANCED PACKAGING B.V.
MICROWEG 1-11, 6545 CL NIJMEGEN, NETHERLANDS
Covered Property (1)
Method for Encapsulating a Chip and/or Other Article
Patent: 7,205,175 →
Application: 10/490,945 →
Publication: US 2005/0054144
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 12, 2004
From: RABEN, JURGEN LEONARDUS THEODORUS MARIA
To: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
Reel/Frame 015241/0578 →
Assignment of Assignor's Interest Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →