IP Library › Assignment 015241/0578
Patent Assignment
Reel/Frame 015241/0578

Assignment of Assignor's Interest

Recorded: 2004-10-12 Pages: 2
Assignor
Assignee
EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
P.O. BOX 566, NIJMEGEN, NL-6500 AN, NETHERLANDS
Covered Property (1)
Method for Encapsulating a Chip and/or Other Article
Patent: 7,205,175 →
Application: 10/490,945 →
Publication: US 2005/0054144
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 27, 2005
From: EUROPEAN SEMICONDUCTOR ASSEMBLY (EURASEM) B.V.
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 016843/0503 →
Assignment of Assignor's Interest Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →