Patent Assignment
Reel/Frame 021026/0909
Assignment of Assignor's Interest
Recorded: 2008-06-02
Pages: 4
Assignor
REIJS, ALBERTUS THEODORUS JOHANNES
Executed: 2008-04-04
Assignee
ELMOS ADVANCED PACKAGING B.V.
MICROWEG 1-11, NIJMEGEN, NL-6546CL, NETHERLANDS
Covered Property
(1)
Sensor Element and Sensor Assembly Provided with a Casing
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's Postal Code Previously Recorded on Reel 021026 Frame 0909. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.
Jul 22, 2008
From: REIJA, ALBERTUS THEODORUS JOHANNES
To: ELMOS ADVANCED PACKAGING B.V.
Reel/Frame 021274/0319 →
Assignment of Assignor's Interest
Jun 20, 2011
From: ELMOS ADVANCED PACKAGING B.V.
To: SENCIO B.V.
Reel/Frame 026480/0333 →
Settlement Agreement
Jun 22, 2012
From: SENCIO B.V.
To: ELMOS SEMICONDUCTOR AG
Reel/Frame 028430/0026 →
Assignment of Assignor's Interest
May 20, 2021
From: ELMOS SEMICONDUCTOR SE
To: SILICON MICROSTRUCTURES, INC.
Reel/Frame 056296/0706 →
Change of Name
May 20, 2021
From: ELMOS SEMICONDUCTOR AG
To: ELMOS SEMICONDUCTOR SE
Reel/Frame 056312/0010 →
Merger
Jun 21, 2022
From: SILICON MICROSTRUCTURES, INC.
To: MEASUREMENT SPECIALTIES, INC.
Reel/Frame 060257/0267 →