Manufacturing catheter sensors
Pressure sensors and their methods of manufacturing, where the pressure sensors have a small, thin form factor and may include features designed to improve manufacturability and where the method of manufacturing may improve yield and reduce overall costs.
1. A pressure sensor comprising:
a membrane formed on a top surface of a handle portion of the pressure sensor;
a base portion opposite the handle portion, the base portion being thicker than the handle portion;
a plurality of bond pads formed on a top surface of the base portion;
a device identifier on a top surface of the pressure sensor; and
a blocking structure on the top surface of the pressure sensor between the plurality of bond pads and the device identifier.
2. The pressure sensor of claim 1 wherein the base portion has a bottom edge away from the handle portion of the pressure sensor, wherein at least one of the plurality of bond pads is spaced a different distance from the bottom edge than at least another one of the plurality of bond pads.
3. The pressure sensor of claim 2 further comprising:
a first tab extending laterally away in a first direction from a top surface of a body of the pressure sensor; and
a second tab extending laterally away in a second direction from a top surface of a body of the pressure sensor, the second direction opposite the first direction.
4. The pressure sensor of claim 3 wherein the first tab includes a first plurality of holes from a top surface of the first tab to a bottom surface of the first tab, the first plurality of holes located at least near the base portion, and
wherein the second tab includes a second plurality of holes from a top surface of the second tab to a bottom surface of the second tab, the second plurality of holes located at least near the base portion.
5. The pressure sensor of claim 4 wherein the first and second pluralities of holes are etched using a KOH etch.
6. The pressure sensor of claim 5 wherein the first and second pluralities of holes are adjacent to the base portion.
7. The pressure sensor of claim 6 wherein the pressure sensor wherein the plurality of bond pads are located between the first tab and the second tab.
8. The pressure sensor of claim 4 wherein the first and second pluralities of holes are etched using a DRIE etch.
9. The pressure sensor of claim 8 wherein the first and second pluralities of holes are adjacent to the base portion.
10. The pressure sensor of claim 9 wherein the plurality of bond pads are located between the first tab and the second tab.
11. The pressure sensor of claim 3 wherein the blocking structure is a trench that is etched into the top surface of the pressure sensor.
12. The pressure sensor of claim 2 wherein the blocking structure is a trench that is etched into the top surface of the pressure sensor.
13. The pressure sensor of claim 12 wherein the blocking structure is etched into the top surface of the pressure sensor when the device identifier is etched.
14. The pressure sensor of claim 13 wherein the trench and device identifier are etched using a KOH etch.
15. The pressure sensor of claim 13 wherein the trench and device identifier are etched using a deep-reactive ion etch (DRIE).
16. The pressure sensor of claim 2 wherein the blocking structure is a raised bar that is deposited on the top surface of the pressure sensor.
17. The pressure sensor of claim 16 wherein the raised bar blocking structure is deposited on the top surface of the pressure sensor when the plurality of bond pads are deposited.
18. The pressure sensor of claim 2 wherein the blocking structure is a raised bar that is solder bumped on the top surface of the pressure sensor.
19. The pressure sensor of claim 18 wherein the blocking structure is solder bumped on the top surface of the pressure sensor when the plurality of bond pads are solder bumped.
20. The pressure sensor of claim 2 wherein the blocking structure comprises a trench and a raised bar.
21. The pressure sensor of claim 2 further comprising:
a housing attached to an underside of the base portion, wherein the housing is not attached to an underside of the handle portion.
22. The pressure sensor of claim 21 wherein the handle portion is thinner than the base portion following an etching of an underside of the handle portion.
23. The pressure sensor of claim 21 wherein the base portion is attached to the housing using epoxy.
24. The pressure sensor of claim 1 further comprising:
a first tab extending laterally away in a first direction from a top surface of a body of the pressure sensor; and
a second tab extending laterally away in a second direction from a top surface of a body of the pressure sensor, the second direction opposite the first direction.
25. The pressure sensor of claim 24 wherein the first tab includes a first plurality of holes from a top surface of the first tab to a bottom surface of the first tab, the first plurality of holes located at least near the base portion, and
wherein the second tab includes a second plurality of holes from a top surface of the second tab to a bottom surface of the second tab, the second plurality of holes located at least near the base portion.
26. The pressure sensor of claim 1 wherein the blocking structure is a trench that is etched into the top surface of the pressure sensor.
27. The pressure sensor of claim 26 further comprising:
a first tab extending laterally away in a first direction from a top surface of a body of the pressure sensor; and
a second tab extending laterally away in a second direction from a top surface of a body of the pressure sensor, the second direction opposite the first direction.
28. The pressure sensor of claim 27 wherein the first tab includes a first plurality of holes from a top surface of the first tab to a bottom surface of the first tab, the first plurality of holes located at least near the base portion, and
wherein the second tab includes a second plurality of holes from a top surface of the second tab to a bottom surface of the second tab, the second plurality of holes located at least near the base portion.