Patent Assignment
Reel/Frame 022180/0544
Assignment of Assignor's Interest
Recorded: 2009-01-30
Pages: 3
Assignor
LEI, KUOLUNG
Executed: 2009-01-29
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY RD., SAN JOSE, CALIFORNIA, 95138
Covered Property
(1)
Methods of Forming Microelectronic Packaging Substrates Having Through-Substrate Vias Therein
Patent:
7,842,613 →
Application:
12/349,677 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest
Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →