Patent Assignment
Reel/Frame 022252/0846
Assignment of Assignor's Interest
Recorded: 2009-02-12
Pages: 3
Assignor
CHEN, NAN-CHENG
Executed: 2009-02-09
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Flip-Chip Package with Fan-Out Wlcsp
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.