Patent Assignment
Reel/Frame 071215/0320
Assignment of Assignor's Interest
Recorded: 2025-05-25
Pages: 13
Assignor
MEDIATEK INC.
Executed: 2025-05-06
Assignee
MOSAID TECHNOLOGIES, INC.
515 LEGGET DRIVE, SUITE 100, OTTAWA, K2K 3G4, CANADA
Covered Properties
(5)
Flip-Chip Package with Fan-Out Wlcsp
System-In-Package with Fan-Out Wlcsp
Package-On-Package with Fan-Out Wlcsp
Flip-chip package with Fan-out WLCSP
Application:
61/056,401 →
Flip-Chip Package with Fan-Out Wlcsp
Application:
61/347,494 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 12, 2009
From: CHEN, NAN-CHENG
To: MEDIATEK INC.
Reel/Frame 022252/0846 →
Assignment of Assignor's Interest
Oct 15, 2010
From: CHEN, NAN-CHENG; HSU, CHIH-TAI
To: MEDIATEK INC.
Reel/Frame 025142/0693 →
Assignment of Assignor's Interest
Oct 25, 2011
From: CHEN, NAN-CHENG; HSU, CHIH-TAI
To: MEDIATEK INC.
Reel/Frame 027111/0787 →