Patent Assignment
Reel/Frame 022304/0273
Assignment of Assignor's Interest
Recorded: 2009-02-24
Pages: 6
Assignors
DIAZ, CARLOS H.
Executed: 2009-02-13
SHEU, YI-MING
Executed: 2009-02-13
WANG, ANSON
Executed: 2009-02-13
THEI, KONG-BENG
Executed: 2009-02-13
CHUNG, SHENG-CHEN
Executed: 2009-02-13
TSAI, HAO-YI
Executed: 2009-02-17
CHEN, HSIEN-WEI
Executed: 2009-02-19
CHUANG, HARRY HAK-LAY
Executed: 2009-02-13
JENG, SHIN-PUU
Executed: 2009-02-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
New Method for Mechanical Stress Enhancement in Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.