IP Library › Assignment 060024/0288
Patent Assignment
Reel/Frame 060024/0288

Assignment of Assignor's Interest

Recorded: 2022-05-26 Pages: 4
Assignor
Assignee
MOSAID TECHNOLOGIES INC.
515 LEGGET DRIVE, SUITE 100, OTTAWA, K2K 3G4, CANADA
Covered Properties (5)
New Method for Mechanical Stress Enhancement in Semiconductor Devices
Patent: 9,349,655 →
Application: 12/391,821 →
Publication: US 2010/0052065
Two-Step Sti Formation Process
Patent: 7,842,577 →
Application: 12/127,646 →
Publication: US 2009/0298248
Two-Step Sti Formation Process
Patent: 8,338,909 →
Application: 12/910,638 →
Publication: US 2011/0031541
Semiconductor Device with Contact Structure with First/Second Contacts Formed in First/Second Dielectric Layers and Method of Forming Same
Patent: 8,952,547 →
Application: 11/775,039 →
Publication: US 2009/0014796
Semiconductor Device with Improved Contact Structure and Method of Forming Same
Patent: 9,564,433 →
Application: 14/617,467 →
Publication: US 2015/0221642
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2007
From: LIAW, JHON-JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 019540/0438 →
Assignment of Assignor's Interest May 29, 2008
From: FUNG, KA-HING
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 021017/0029 →
Assignment of Assignor's Interest Feb 24, 2009
From: DIAZ, CARLOS H.; SHEU, YI-MING; WANG, ANSON; THEI, KONG-BENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 022304/0273 →
Assignment of Assignor's Interest Aug 29, 2015
From: LIAW, JHON-JHY
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036453/0975 →