IP Library Assignment 022317/0239
Patent Assignment
Reel/Frame 022317/0239

Assignment of Assignor's Interest

Recorded: 2009-02-26 Pages: 4
Assignors
WANG, YE
Executed: 2009-02-25
BHUGRA, HARMEET
Executed: 2009-02-26
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
6024 SILVER CREEK VALLEY RD., SAN JOSE, CALIFORNIA, 95138
Covered Property (1)
Thin-Film Bulk Acoustic Resonators Having Perforated Bodies That Provide Reduced Susceptibility to Process-Induced Lateral Dimension Variations
Patent: 7,939,990 →
Application: 12/393,566 →
Publication: US 2010/0194241
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →