IP Library Granted Patent US 7,939,990
Granted Patent B2
US 7,939,990 · App. 12/393,566 · Granted May 10, 2011

Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations

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Quick Facts
Patent No.
US 7,939,990
App. No.
12/393,566
Granted
May 10, 2011
Kind
B2
Abstract

Micro-electromechanical acoustic resonators include a resonator body suspended over a substrate. The resonator body may have a single perforation therein, which may extend substantially or completely therethrough. The resonator body may also be configured to have a center-of-mass within an interior of the perforation and/or a nodal line that overlaps the perforation. A perimeter and depth of the single perforation can be configured to reduce a susceptibility of the acoustic resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation. In other embodiments, the resonator body may have multiple perforations therein that extend along a nodal line of the resonator.

Claims (32)

1. A micro-electromechanical acoustic resonator, comprising:

a resonator body suspended over a substrate, said resonator body having a single perforation therein extending at least substantially therethrough at a location that overlaps with a nodal line of said resonator body when said resonator body is operating at resonant frequency, said resonator body having a sidewall that is separated from an opposing sidewall of the substrate by a distance equivalent to a width of the single perforation.

2. The resonator of claim 1 , wherein a perimeter and depth of the single perforation is configured to reduce a susceptibility of the resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation.

3. The resonator of claim 1 , wherein said resonator body is anchored on opposite sides to the substrate.

4. The resonator of claim 3 , wherein said resonator body is suspended opposite a recess in the substrate.

5. The resonator of claim 1 , wherein a length (L s ) and the width (W s ) of the single perforation is related to a length (L rb ) and a width (W rb ) of said resonator body by the following relationship:

(0.4) L rb ( W s /2( L rb −W rb +W s )) 1/2 ≦L s ≦(0.6) L rb ( W s /2( L rb −W rb +W s )) 1/2 ,

where the length (L rb ) is greater than the width (W rb ), and the length (L s ) is greater than the width (W s ).

6. The resonator of claim 5 , wherein said resonator body and the single perforation are rectangular shaped.

7. The resonator of claim 1 , wherein said resonator body and the single perforation are rectangular shaped.

8. A micro-electromechanical acoustic resonator, comprising:

a resonator body suspended over a substrate, said resonator body having a single perforation therein extending at least substantially therethrough at a location that overlaps with a nodal line of said resonator body when said resonator body is operating at resonant frequency, said single perforation having a length (L s ) and a width (W s ) that is related to a length (L rb ) and a width (W rb ) of said resonator body by the following relationship:

(0.4) L rb ( W s /2( L rb −W rb +W s )) 1/2 ≦L s ≦(0.6) L rb ( W s /2( L rb −W rb +W s )) 1/2 ,

where the length (L rb ) is greater than the width (W rb ), and the length (L s ) is greater than the width (W s ).

9. The resonator of claim 8 , wherein said resonator body and the single perforation are rectangular shaped.

10. A micro-electromechanical acoustic resonator, comprising:

a resonator body anchored on opposite sides to a substrate having a recess therein extending underneath said resonator body, said resonator body having at least one perforation therein extending at least substantially therethrough, said at least one perforation having a length (L s ) and a width (W s ) that are related to a length (L rb ) and a width (W rb ) of said resonator body by the following relationship:

(0.4) L rb ( W s /2( L rb −W rb +W s )) 1/2 ≦L s ≦(0.6) L rb ( W s /2( L rb −W rb +W s )) 1/2 ,

where the length (L rb ) is greater than the width (W rb ), and the length (L s ) is greater than the width (W s ).

11. The resonator of claim 10 , wherein the at least one perforation is aligned with a nodal line of said resonator body.

12. The resonator of claim 10 , wherein the at least one perforation extends entirely through said resonator body.

13. The resonator of claim 10 , wherein said resonator body and the at least one perforation are rectangular shaped.

14. A micro-electromechanical acoustic resonator, comprising:

a resonator body anchored on opposite sides to a substrate having a recess therein extending underneath said resonator body, said resonator body having N perforations therein extending at least substantially therethrough, with at least one of the N perforations having a length (L s ) and width (W s ) that are related to a length (L rb ) and a width (W rb ) of said resonator body by the following relationship:

(0.4) L rb ( W s /2( L rb −( W rb /N ) +W s )) 1/2 ≦L s ≦(0.6) L rb ( W s /2( L rb −( W rb /N ) +W s )) 1/2 ,

where the length (L rb ) is less than the width (W rb ) and “N” is an integer greater than one.

15. The resonator of claim 14 , wherein the N perforations are arranged along a nodal line of said resonator body.

16. The resonator of claim 15 , wherein a center-to-center pitch between the N perforations is equivalent to λ/4, where λ is a wavelength associated with a resonant frequency of the resonator.

17. The resonator of claim 14 , wherein said resonator body is configured to have a center-of-mass within an interior of one of the N perforations.

18. The resonator of claim 17 , wherein the N perforations are arranged along a nodal line of said resonator body.

19. The resonator of claim 14 , wherein said resonator body is configured to have a projected point of maximum stress within an interior of one of the N perforations when said resonator body is operating at a resonant frequency.

20. The resonator of claim 14 , wherein said resonator body and the N perforations are rectangular shaped.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2009
From: WANG, YE; BHUGRA, HARMEET
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 022317/0239 →