Patent Assignment
Reel/Frame 022345/0397
Assignment of Assignor's Interest
Recorded: 2009-03-04
Pages: 8
Assignors
CO, REYNALDO, MR
Executed: 2009-01-23
MELCHER, DEANN EILEEN, MS
Executed: 2009-01-23
PAN, WEIPING, MR
Executed: 2009-02-04
VILLAVICENCIO, GRANT, MR
Executed: 2009-02-04
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Properties
(2)
Semiconductor Die Separation Method
Semiconductor die separation method
Application:
61/132,708 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Dec 6, 2012
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029458/0905 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →