Patent Assignment
Reel/Frame 022420/0920
Assignment of Assignor's Interest
Recorded: 2009-03-19
Pages: 3
Assignor
GUPTA, PUNEET
Executed: 2009-03-18
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, MAIL ZONE 33, ST. PETERS, MISSOURI, 63376-5000
Covered Property
(1)
Carbon Nanotube Reinforced Wiresaw Beam Used in Wiresaw Slicing of Ingots into Wafers
Application:
12/367,058 →
Publication:
US 2009/0199836
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Security Agreement
Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →