Patent Assignment
Reel/Frame 022424/0460
Assignment of Assignor's Interest
Recorded: 2009-03-16
Pages: 2
Assignors
KANG, DONG-MIN
Executed: 2009-03-03
KANG, BO-RAM
Executed: 2009-03-03
KIM, YOUNG-NAM
Executed: 2009-03-03
LIM, YOUNG-SAM
Executed: 2009-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming a Bump Structure Using an Etching Composition for an Under Bump Metallurgy Layer