Patent Assignment
Reel/Frame 022440/0215
Corrective Assignment to Correct to Additional Conveying Party, Previously Recorded at Reel 012181, Frame 0138.
Recorded: 2009-03-24
Pages: 4
Assignors
LEE, JIN-YUAN
Executed: 2001-08-01
LEI, MING-TA
Executed: 2001-08-01
HUANG, CHING-CHENG
Executed: 2001-08-01
LIN, CHUEN-JYE
Executed: 2001-08-01
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Method Making a Low Fabrication Cost, High Performance, High Reliability Chip Scale Package
Patent:
6,642,136 →
Application:
09/953,525 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 17, 2001
From: LEE, JIN YUAN; LEI, MING TA; HUANG, CHING CHENG
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Reel/Frame 012181/0138 →
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →