IP Library › Assignment 022457/0186
Patent Assignment
Reel/Frame 022457/0186

Assignment of Assignor's Interest

Recorded: 2009-03-18 Pages: 3
Assignors
TANAKA, KOUJI
Executed: 2009-03-03
ISOZAKI, SEIYA
Executed: 2009-03-03
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Wafer, Semiconductor Device, and Method of Manufacturing Semiconductor Device
Patent: 7,994,614 →
Application: 12/382,540 →
Publication: US 2009/0243044
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 28, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025214/0187 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →