Patent Assignment
Reel/Frame 022486/0687
Assignment of Assignor's Interest
Recorded: 2009-04-01
Pages: 3
Assignee
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property
(1)
Ic Die Having Tsv and Wafer Level Underfill and Stacked Ic Devices Comprising a Workpiece Solder Connected to the Tsv