IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

1. A method of forming integrated circuit (IC) die configured for attachment to another die or a package substrate, comprising:

providing at least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) comprising a tip extending from said top semiconductor surface to protrude beyond said bottom surface to a tip length, said tip having an outer dielectric tip liner, and an electrically conductive portion within said outer dielectric tip liner;

applying a compliant layer, thicker than said tip length, to said bottom surface of said IC die;

thinning said compliant layer to expose said dielectric tip liner from said distal portion of said tip;

removing said dielectric tip liner from a distal portion of said tip to form an exposed electrically conductive tip portion;

depositing a solder material on said exposed electrically conductive tip portion of said tip;

patterning said solder material using a resist material into an isolated region centered over said tip; and

reflowing and coalescing said solder material to form a solder bump on said exposed electrically conductive tip portion of said tip.

2. The method of claim 1 , wherein said tip length is 5 to 50 μm.

3. The method of claim 1 , further comprising a wafer, wherein said wafer comprises a plurality of said IC die.

4. The method of claim 1 , further comprising:

attaching said IC die to another IC die or a package substrate to form solder joints comprising said solder material from said solder bump, wherein said compliant layer becomes interposed between said IC die and said another IC die or said package substrate, said attaching being exclusive of an underfill filling step.

5. The method of claim 1 , wherein said reflowing and coalescing reflows said solder material into a dome shaped bump.

6. A method of forming integrated circuit (IC) die configured for attachment to another die or a package substrate, comprising:

providing at least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) comprising a tip extending from said top semiconductor surface to protrude beyond said bottom surface to a tip length, said tip having an outer dielectric tip liner, and an electrically conductive portion within said outer dielectric tip liner;

applying a compliant layer, thicker than said tip length, to said bottom surface of said IC die:

thinning said compliant layer to expose said dielectric tip liner from said distal portion of said tip;

removing said dielectric tip liner from a distal portion of said tip to form an exposed electrically conductive tip portion;

forming a blanket metal comprising a seed layer on said bottom surface of said die;

forming a dielectric layer over said seed layer;

grinding or polishing said dielectric layer to re-expose said exposed electrically conductive tip portion;

electroplating a solder material on said exposed electrically conductive tip portion, wherein said dielectric layer acts as an etch mask beyond said tip;

removing said dielectric layer and said metal comprising seed layer;

reflowing and coalescing said solder material to form a solder bump on said exposed electrically conductive tip portion of said tip.

7. The method of claim 1 , further comprising the step of forming an opening in said compliant layer over said tip having an area larger than said tip before said removing step.

8. The method of claim 7 , wherein a laser is used for said forming an opening.

9. The method of claim 7 , wherein said depositing comprises electroless deposition of said solder material in said opening.

10. The method of claim 7 , wherein said depositing comprises depositing a ball of said solder material in said opening.

11. The method of claim 1 , wherein said compliant layer comprises a solder resist, liquid plating resist, a polyimide, or a polybenzoxazole.