IP Library › Assignment 022542/0113
Patent Assignment
Reel/Frame 022542/0113

Change of Name

Recorded: 2009-04-14 Pages: 2
Assignor
SHIPLEY COMPANY, L.L.C.
Executed: 2004-01-19
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS LLC
455 FOREST STREET, MARLBOROUGH, MARYLAND, 01752
Covered Property (1)
Wafer Level Packaging for Optoelectronic Devices
Patent: 7,345,316 →
Application: 09/999,517 →
Publication: US 2004/0264866
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 15, 2002
From: STEINBERG, DAN A.; HUGHES, WILLIAM T.; DAUTARTAS, MINDAUGAS F.; MEDER, MARTIN G.
To: HALEOS, INC.
Reel/Frame 013174/0328 →
Assignment of Assignor's Interest Oct 15, 2002
From: HALEOS, INC.
To: SHIPLEY COMPANY, L.L.C.
Reel/Frame 013181/0159 →
Assignment of Assignor's Interest Apr 14, 2009
From: ROHM AND HAAS ELECTRONIC MATERIALS LLC
To: NUVOTRONICS, LLC
Reel/Frame 022542/0125 →
Assignment of Assignor's Interest Mar 15, 2011
From: NUVOTRONICS, LLC
To: IP CUBE PARTNERS CO. LTD.
Reel/Frame 025955/0330 →
Assignment of Assignor's Interest May 23, 2011
From: IP CUBE PARTNERS CO. LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026323/0651 →