Patent Assignment
Reel/Frame 022577/0868
Assignment of Assignor's Interest
Recorded: 2009-04-10
Pages: 3
Assignor
KATOU, TETSUYA
Executed: 2009-04-02
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device Including Offset Bonding Pad and Inspection Method Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.