Patent Assignment
Reel/Frame 022627/0700
Assignment of Assignor's Interest
Recorded: 2009-05-01
Pages: 3
Assignee
SUMCO TECHXIV CORPORATION
1324-2, MASURAGAHARA-MACHI, OMURA-SH, NAGASAKI 856-8555, JAPAN
Covered Property
(1)
Semiconductor Wafer Processing Method and Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.