Patent Assignment
Reel/Frame 022708/0564
Corrective Assignment to Correct the Conveyance Type, Receiving Party and Execution Date Previously Recorded on Reel 010951 Frame 0606. Assignor(S) Hereby Confirms the Conveyance Type Should Be Name Change, Receiving Party Should Be Hyundai Microelectronics Co., Ltd. and Date Is 7/26/1999.
Recorded: 2009-05-20
Pages: 85
Assignor
LG SEMICON CO., LTD.
Executed: 1999-07-26
Assignee
HYUNDAI MICROELECTRONICS CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-KU, CHEONGJU, KOREA, REPUBLIC OF
Covered Properties
(3)
Serial Data Transmission Apparatus and Method with a Data Checking Feature
Patent:
6,357,031 →
Application:
09/021,939 →
Pixel Structure of Active Pixel Sensor (Aps) with Electronic Shutter Function
Patent:
6,549,234 →
Application:
09/170,105 →
Pipelined Fast Fourier Transform (Fft) Processor Having Convergent Block Floating Point (Cbfp) Algorithm
Patent:
6,366,936 →
Application:
09/303,688 →
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 11, 1998
From: LEE, DAE-HUN
To: LG SEMICON CO., LTD.
Reel/Frame 008982/0235 →
Assignment of Assignor's Interest
Oct 13, 1998
From: LEE, SUNG-MIN
To: LG SEMICON CO., LTD.
Reel/Frame 009517/0596 →
Assignment of Assignor's Interest
May 3, 1999
From: LEE, KYA-SEON; PARK, SANG-JIN; JANG, LAK-HYUN; HAN, JUNG-IL
To: LG SEMICON CO., LTD.
Reel/Frame 009938/0526 →
Merger
Jul 11, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES, CO., LTD.
Reel/Frame 010951/0606 →
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015242/0899 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest
Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
Merger
May 27, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022742/0478 →
Corrective Assignment to Correct the Country in the Address of the Receiving Party Previously Recorded on Reel 022742 Frame 0478. Assignor(S) Hereby Confirms the Country Should Be Republic of Korea.
May 28, 2009
From: HYUNDAI MICRO ELECTRONICS CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 022746/0279 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Assignment of Assignor's Interest
Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: YAT-SEN HOLDINGS, LLC
Reel/Frame 023094/0034 →
Merger
Dec 7, 2010
From: YAT-SEN HOLDINGS, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 025467/0090 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest
Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest
Feb 2, 2020
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0107 →