IP Library › Assignment 022742/0410
Patent Assignment
Reel/Frame 022742/0410

Corrective Assignment to Correct the Conveyance Type, Conveying Party, Receiving Party and Date Previously Recorded on Reel 015394 Frame 0001. Assignor(S) Hereby Confirms the Merger of Hyundai Micro Electronics Co., Ltd. to Hyundai Electronics Industries Co., Ltd. on 10/14/1999.

Recorded: 2009-05-27 Pages: 48
Assignor
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Properties (5)
Linear Charge-Coupled Device Having Improved Charge Transferring Characteristics
Patent: 5,869,853 →
Application: 08/784,388 →
Multi-Hood System for Correcting Individual Lens Distortions
Patent: 5,920,377 →
Application: 08/827,188 →
Hysteresis Input Buffer
Patent: 6,188,244 →
Application: 09/159,759 →
Method for Fabricating Solid State Image Sensor
Patent: 6,210,990 →
Application: 09/350,086 →
Solid State Image Sensor Device and Method of Fabricating the Same
Patent: 6,236,074 →
Application: 09/372,972 →
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 17, 1997
From: YU, YOUNG-JUN
To: LG SEMICON COMPANY, LTD.
Reel/Frame 008403/0142 →
Assignment of Assignor's Interest Mar 27, 1997
From: KIM, KWANG CHUL
To: LG SEMICON COMPANY, LTD.
Reel/Frame 008490/0859 →
Assignment of Assignor's Interest Sep 24, 1998
From: JOO, YANG-SUNG; OH, JOON-HWAN
To: LG SEMICON CO., LTD.
Reel/Frame 009491/0603 →
Assignment of Assignor's Interest Jul 9, 1999
From: KWON, KYOUNG KUK
To: LG SEMICON CO., LTD
Reel/Frame 010100/0125 →
Assignment of Assignor's Interest Aug 12, 1999
From: CHOI, SUN
To: LG SEMICON CO., LTD.
Reel/Frame 010171/0362 →
Change of Name Nov 6, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015348/0001 →
Change of Name Nov 19, 2004
From: LG SEMICON CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015394/0001 →
Assignment of Assignor's Interest Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
Security Interest Mar 25, 2005
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 016470/0530 →
After-Acquired Intellectual Property Kun-Pledge Agreement Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Corrective Assignment to Correct the Receiving Party Previously Recorded on Reel 015348 Frame 0001. Assignor(S) Hereby Confirms the Receiving Party Should Be Hyundai Micro Electronics Co., Ltd. (Branch Office). May 21, 2009
From: LG SEMICON CO., LTD.
To: HYUNDAI MICRO ELECTRONICS CO., LTD. (BRANCH OFFICE)
Reel/Frame 022719/0458 →
Change of Name May 27, 2009
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 022742/0555 →
Assignment of Assignor's Interest May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest May 30, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 022746/0870 →
Partial Release of Security Interest Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Assignment of Assignor's Interest Aug 12, 2009
From: CROSSTEK CAPITAL, LLC
To: CHIAO TUNG HOLDINGS, LLC
Reel/Frame 023085/0864 →
Merger Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest Jan 4, 2020
From: INTELLECTUAL VENTURES ASSETS 158 LLC
To: HANGER SOLUTIONS, LLC
Reel/Frame 051486/0425 →
Assignment of Assignor's Interest Feb 1, 2020
From: CHIAO TUNG HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0081 →
Assignment of Assignor's Interest Feb 2, 2020
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES ASSETS 158 LLC
Reel/Frame 051777/0107 →