Assignment of Assignor's Interest

Recorded: 2009-06-03 Pages: 2

Assignor

HITACHI, LTD.

Executed: 2009-03-09

Assignee

RENESAS TECHNOLOGY CORP.

6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Properties (2)

Method of Producing an Electronic Device Having a Pb Free Solder Connection

Patent: 7,013,564 →

Application: 09/971,566 →

Publication: US 2002/0019077

Pb-Free Solder-Connected Structure and Electronic Device

Patent: 6,960,396 →

Application: 10/187,897 →

Publication: US 2002/0163085

Related Assignments (2)

Other recorded transfers of the patents in this record — the chain of ownership.