Patent Assignment
Reel/Frame 022774/0406
Assignment of Assignor's Interest
Recorded: 2009-06-03
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2009-03-09
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Pb-Free Solder-Connected Structure and Electronic Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.