Patent Assignment
Reel/Frame 022818/0628
Assignment of Assignor's Interest
Recorded: 2009-06-12
Pages: 2
Assignee
PHOENIX PRECISION TECHNOLOGY CORPORATION
NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Package Substrate Having Embedded Photosensitive Semiconductor Chip and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.