Merger

Recorded: 2012-01-26 Pages: 3

Assignor

Executed: 2010-01-13

Assignee

UNIMICRON TECHNOLOGY CORP.

NO. 38, HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN

Covered Property (1)

Package Substrate Having Embedded Photosensitive Semiconductor Chip and Fabrication Method Thereof

Patent: 8,129,829 →

Application: 12/483,497 →

Publication: US 2009/0309179

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.